ECCOBOND DX-20C适用于白光和蓝光LED芯片的绝缘粘接。其特点：1.芯片粘接强度高；2.亮度高，Iv可提升5~15%；3.亮度衰减小；4.减少色差（中间不会太蓝）。
    化学成份 epoxy
    外观 透明浅蓝
    粘度 Cps 12000
    比重 25oC 1.1g
    固化条件 170oC*60min
    玻璃化温度Tg 108C
    保存期 /月 0C/6个月

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